Sensor and Detector Interfaces
Results:0
All Manufacturers
- ABLIC Inc.
- Allegro MicroSystems
- ams
- Analog Devices Inc.
- Analog Devices/Maxim Integrat
- Aptina-ON Semiconductor
- Asahi Kasei Microdevices/AKM
- Atmel
- Azoteq (Pty) Ltd
- Broadcom Limited
- Burr Brown
- Cirrus Logic Inc.
- Diodes Incorporated
- Fairchild Semiconductor
- Freescale Semiconductor
- Grayhill Inc.
- Harris Corporation
- IDT, Integrated Device Technology Inc
- Infineon Technologies
- Interlink Electronics
- Intersil
- LSI/CSI
- Lumissil Microsystems
- MaxLinear, Inc.
- Melexis Technologies NV
- Microchip Technology
- Motorola
- National Semiconductor
- NXP USA Inc.
- onsemi
- Renesas Electronics America
- Rohm Semiconductor
- ScioSense
- Semtech Corporation
- STMicroelectronics
- Texas Instruments
- Triad Semiconductor, Inc.
- Xicor-Division of Intersil
Input Type
- Voltage
- Ionization
- Photoelectric
- Photodiode
- Logic
- Analog
- Digital
- LVDS
- Analog, Digital
- Thermocouple
- Thermocouple (Multiple)
- Differential
- Parallel
- Capacitive, Inductive
- Analog Current
- Serial
- Capacitive
- Thermocouple (K)
- Analog, Logic, Photodiode
- CML
- Thermocouple (J)
- 4 ~ 20mA
- CMOS
- Ultrasound
- Analog Voltage
Mfr
- Texas Instruments
- Allegro MicroSystems
- Analog Devices Inc.
- Analog Devices Inc./Maxim Integrated
- Microchip Technology
- ScioSense
- ams
- Renesas Electronics America Inc
- STMicroelectronics
- Burr Brown
- Intersil
- onsemi
- Xicor-Division of Intersil
- NXP USA Inc.
- Infineon Technologies
- IDT, Integrated Device Technology Inc
- Semtech Corporation
- Azoteq (Pty) Ltd
- Aptina-ON Semiconductor
- Harris Corporation
- Freescale Semiconductor
- Asahi Kasei Microdevices/AKM
- Triad Semiconductor, Inc.
- LSI/CSI
- Rohm Semiconductor
- Motorola
- Cirrus Logic Inc.
- Broadcom Limited
- Grayhill Inc.
- Melexis Technologies NV
- Lumissil Microsystems
- Interlink Electronics
- MaxLinear, Inc.
- ABLIC Inc.
- Diodes Incorporated
Mounting Type
- Surface Mount
- Through Hole
- Surface Mount, Wettable Flank
- Panel Mount
Operating Temperature
- -55°C ~ 125°C
- -10°C ~ 60°C
- -25°C ~ 75°C
- -40°C ~ 85°C
- 0°C ~ 70°C (TA)
- -40°C ~ 95°C
- 0°C ~ 60°C (TA)
- -40°C ~ 125°C (TA)
- -40°C ~ 125°C
- -40°C ~ 100°C
- 150°C
- -25°C ~ 85°C
- -40°C ~ 150°C
- -40°C ~ 85°C (TA)
- 0°C ~ 70°C
- -40°C ~ 105°C (TA)
- -25°C ~ 105°C (TA)
- -20°C ~ 85°C
- -40°C ~ 115°C
- -40°C ~ 120°C
- 0°C ~ 90°C
- -20°C ~ 75°C
- -40°C ~ 105°C
- 0°C ~ 85°C
- -40°C ~ 90°C (TA)
- 0°C ~ 85°C (TA)
- -40°C ~ 70°C (TA)
- -40°C ~ 110°C
- -10°C ~ 60°C (TA)
- -40°C ~ 150°C (TA)
- 20°C ~ 85°C
- -20°C ~ 45°C
- 0°C ~ 50°C
- -30°C ~ 75°C
- 25°C ~ 100°C
- -45°C ~ 125°C
- -55°C ~ 150°C
- -40°C ~ 140°C
- -20°C ~ 70°C
- -25°C ~ 70°C (TA)
- -20°C ~ 105°C (TA)
Output Type
- Current
- Voltage
- I2C
- SPI
- Serial
- Logic
- LVDS
- Digital
- LIN
- I2C, SPI
- Digital, Serial
- 2-Wire
- Analog
- 3-Wire Serial
- 4mA ~ 20mA
- I2C, Serial
- Analog, Digital
- Differential
- Serial, SPI
- 1-Wire?, I2C, SPI
- CML
- Thermocouple
- 4 ~ 20mA
- Analog Voltage
- CMOS
- Parallel
Package
- Tape & Reel (TR)
- Tube
- Tray
- Strip
- Bulk
- Bag
- Box
- Cut Tape (CT)
Package / Case
- 20-VQFN Exposed Pad
- 16-DIP (0.300", 7.62mm)
- 12-LFLGA
- 48-WFQFN Exposed Pad, CSP
- 28-SSOP (0.209", 5.30mm Width)
- 28-WFQFN Exposed Pad
- 16-SOIC (0.154", 3.90mm Width)
- 48-LQFP
- 64-LQFP
- 40-VFQFN Exposed Pad
- 14-TSSOP (0.173", 4.40mm Width)
- 8-SOIC (0.154", 3.90mm Width)
- 14-SOIC (0.154", 3.90mm Width)
- 105-LFBGA, CSPBGA
- 48-TQFP Exposed Pad
- 24-WFQFN Exposed Pad
- 20-WFQFN Exposed Pad, CSP
- 33-UFBGA, WLCSP
- 35-UFBGA, WLCSP
- 84-LFBGA, CSPBGA
- 28-LCC (J-Lead)
- 16-SSOP (0.154", 3.90mm Width)
- Die
- 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
- 16-WFBGA, WLBGA
- 12-WFBGA, WLBGA
- 20-WFQFN Exposed Pad
- 44-LCC (J-Lead)
- 16-SOIC (0.295", 7.50mm Width)
- 128-LFBGA, CSPBGA
- 32-WFQFN Exposed Pad, CSP
- 64-LFBGA, CSPBGA
- 56-VFQFN Exposed Pad, CSP
- 40-VFQFN Exposed Pad, CSP
- 48-VFQFN Exposed Pad, CSP
- 28-SOIC (0.295", 7.50mm Width)
- 64-QFP
- 96-LFBGA, CSPBGA
- 64-VFQFN Exposed Pad, CSP
- 20-SOIC (0.295", 7.50mm Width)
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- 48-TQFP
- 8-DIP (0.300", 7.62mm)
- 14-DIP (0.300", 7.62mm)
- 24-SOIC (0.295", 7.50mm Width)
- 24-VFQFN Exposed Pad
- 28-WFQFN Exposed Pad, CSP
- 38-TFSOP (0.173", 4.40mm Width) Exposed Pad
- 20-SOIC (0.295", 7.50mm Width) Exposed Pad
- 44-VFQFN Exposed Pad
- 16-UFBGA, WLCSP
- 38-VFLGA Module
- 10-VFDFN Exposed Pad
- 14-CDIP (0.300", 7.62mm)
- 16-WQFN Exposed Pad
- 16-WFQFN Exposed Pad
- 9-UFBGA, WLCSP
- 16-TSSOP (0.173", 4.40mm Width)
- 20-TSSOP (0.173", 4.40mm Width)
- 10-WFDFN Exposed Pad
- SOT-23-6 Thin, TSOT-23-6
- 9-XFBGA, WLCSP
- 28-VQFN Exposed Pad
- 84-TFBGA
- 18-UFBGA, WLCSP
- 20-UFQFN Exposed Pad
- 16-SSOP (0.209", 5.30mm Width)
- 100-LFBGA, CSPBGA
- 16-VQFN Exposed Pad, CSP
- 16-XFQFN Exposed Pad
- 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
- 24-UFBGA, WLCSP
- 10-PowerTFSOP, 10-MSOP (0.118", 3.00mm Width)
- 24-SSOP (0.209", 5.30mm Width)
- 20-PowerTSSOP (0.173", 4.40mm Width)
- 112-LFBGA, CSPBGA
- 68-VFQFN Exposed Pad
- 12-WFDFN Exposed Pad
- 16-VQFN Exposed Pad
- 24-SSOP (0.154", 3.90mm Width)
- 8-VDFN Exposed Pad
- 20-CDIP (0.300", 7.62mm)
- 40-WFQFN Exposed Pad
- 36-WFBGA, WLBGA
- 32-SOP (0.213", 5.40mm Width)
- 16-LSOP (0.173", 4.40mm Width)
- 12-WFQFN Exposed Pad
- 49-VFBGA
- 8-UFDFN Exposed Pad
- 16-VFQFN Exposed Pad
- 14-LSSOP (0.173", 4.40mm Width)
- 16-LSSOP (0.173", 4.40mm Width)
- 16-CDIP (0.300", 7.62mm)
- 20-SSOP (0.209", 5.30mm Width)
- 44-LQFP
- 8-CDIP (0.300", 7.62mm)
- TO-205AA, TO-5-8 Metal Can
- 36-UFBGA, DSBGA
- 28-TSSOP (0.173", 4.40mm Width)
- 6-WDFN Exposed Pad
- 18-DIP (0.300", 7.62mm)
- 14-SSOP (0.209", 5.30mm Width)
- 28-TSSOP (0.173", 4.40mm Width) Exposed Pad
- 14-SOIC (0.295", 7.50mm Width)
- 20-LCC (J-Lead)
- 32-VFQFN Exposed Pad, 32-MLF?
- 20-VFQFN Exposed Pad
- 32-TQFP Exposed Pad
- 8-FlipChip
- Module
- 196-LFBGA, CSPBGA
- 28-UFQFN Exposed Pad
- 8-VFDFN Exposed Pad
- 14-VFQFN Exposed Pad
- 36-VFQFN Exposed Pad
- 32-VFQFN Exposed Pad
- 120-TFBGA
- 100-TQFP
- 48-VFQFN Exposed Pad
- 56-WFQFN Exposed Pad
- 44-BSSOP (0.433", 11.00mm Width) Exposed Pad
- 28-VFQFN Exposed Pad
- 16-SOIC (0.173", 4.40mm Width)
- 64-PowerTQFP
- 16-UFQFN Exposed Pad
- 38-DIP (0.800", 20.32mm), 12 Leads
- SC-74A, SOT-753
- 38-DIP (0.500", 12.70mm), 8 Leads
- 28-DIP (0.500", 12.70mm), 22 Leads
- 38-DIP (0.800", 20.32mm), 15 Leads
- 20-CLCC
- 24-CDIP (0.600", 15.24mm)
- 25-TFBGA
- 64-VFQFN Exposed Pad
- 48-PowerTQFP
- 32-WFQFN Exposed Pad
- 84-VFQFN Dual Rows, Exposed Pad
- 28-LSSOP (0.220", 5.60mm Width)
- 17-UFBGA, WLCSP
- 70-LFBGA
Product Status
- Active
- Obsolete
- Not For New Designs
Series
- Automotive, AEC-Q100
- *
- AD9840
- AD9847
- AD9929
- AD9995
- TPS
- IQ Switch?, ProxFusion?
- IQ Switch? ProxFusion?
- IQ Switch?, ProxSense?
- ZoomingADC?
- QTwo?
- LT?
- 65
- PICOSTRAIN?
- MicroJoystick
Type
- Output Driver
- Smoke Detector
- Front End
- Sensor Interface - Unprogrammed
- Signal Conditioner
- SFP Laser Controller
- Interface
- Converter
- Sensor Conditioner
- Proximity Detector
- CCD Signal Processor, 12-Bit
- Thermocouple to Digital Converter
- Controller
- CCD Signal Processor, 14-Bit
- Hall Effect Sensor
- Biometric Sensor Hub
- Sensor Interface
- R/D Converter
- Current Transmitter
- CCD Signal Processor, 10-Bit
- Image Sensor
- Battery Management
- Engine Knock Signal Processor
- Temperature Sensor
- Resistive
- Pressure Sensor
- Capacitive Touch Screen Controller
- Light to Digital Converter
- Capacitive Sensor
- Sensor Interface, Signal Conditioner
- Motion Coprocessor
- Hub
- Thermocouple Conditioner
- Variable Reluctance
- Capacitance-to-Digital Converter
- Relay/Load Driver
- Data Acquisition System (DAS)
- Automotive
- Data Acquisition
- Power Management
- Capacitive Switch
- Distance Measuring, Preamplifier
- Horn Driver
- Optical
- Smart Sensor
- Programmable Amplifier/Attenuator
- Preamplifier
- Signal Processor
- SFP+ Controller
- Thermocouple Amplifier
- Touch Sensor
- Detector Controller
- Clock Generator
- Current Loop Protector
- Serializer
- Capacitive Touch and Proximity Sensor
- Infrared (IR)
- Distributed Systems Interface
- Time to Flight to Digital Converter
- Translator
- ADC, DAC
- Level Shifter
- Capacitive Sensor Controller
- USB Joystick Controller
- Piezoelectric - Strain Gauge
- Capacitive Switch Controller
Compare |
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Part Number |
Manufacturer |
Datasheet |
Quantity |
Base Product Number |
Current - Supply |
Input Type |
Mfr |
Mounting Type |
Operating Temperature |
Output Type |
Package |
Package / Case |
Product Status |
Series |
Supplier Device Package |
Type |
No data