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All Manufacturers

  • Advanced Micro Devices
  • AMD Xilinx
  • Analog Devices/Maxim Integrat
  • Benchmarq
  • Cypress Semiconductor Corp
  • IBM
  • Intel
  • National Semiconductor
  • Renesas Electronics America
  • Rochester Electronics, LLC
  • Rohm Semiconductor
  • Silicon Motion, Inc.
  • SMSC
  • Texas Instruments

Base Product Number

  • DS1314
  • MXD1210
  • DS1321
  • DS1210
  • CY7C68033
  • CY7C68034
  • DS1211
  • DS1212
  • DS1218
  • DS1312
  • 4DB0226
  • 4DB0232
  • 4RCD0232
  • 4MX0121
  • XCCACE
  • CY7C68023
  • CY7C68024
  • BQ2201
  • BQ2204
  • BQ2205
  • DS1222
  • DP8421
  • DP8422
  • BU9346
  • NSBM
  • DS1213
  • DS1216
  • DS1221
  • BU9348
  • SM223

Controller Type

  • Nonvolatile RAM
  • NAND Flash - USB
  • Nonvolatile SRAM
  • Dynamic RAM (DRAM)
  • CompactFlash
  • Static RAM (SRAM)
  • Smartsocket SRAM
  • Smartwatch RAM
  • Smartwatch ROM

Mfr

  • Analog Devices Inc./Maxim Integrated
  • Cypress Semiconductor Corp
  • Benchmarq
  • Advanced Micro Devices
  • Intel
  • National Semiconductor
  • Texas Instruments
  • Renesas Electronics America Inc
  • Rochester Electronics, LLC
  • IBM
  • AMD Xilinx
  • SMSC
  • Rohm Semiconductor
  • Silicon Motion, Inc.

Mounting Type

  • Surface Mount
  • Through Hole

Operating Temperature

  • -40°C ~ 85°C
  • 0°C ~ 70°C
  • 0°C ~ 70°C (TA)
  • -55°C ~ 125°C (TA)
  • -40°C ~ 105°C (TJ)
  • -20°C ~ 70°C
  • -25°C ~ 75°C

Package

  • Tape & Reel (TR)
  • Tube
  • Tray
  • Bulk

Package / Case

  • 8-SOIC (0.154", 3.90mm Width)
  • 16-SOIC (0.295", 7.50mm Width)
  • 8-DIP (0.300", 7.62mm)
  • 16-DIP (0.300", 7.62mm)
  • 56-VFQFN Exposed Pad
  • 16-SOIC (0.154", 3.90mm Width)
  • 20-DIP (0.300", 7.62mm)
  • 20-SOIC (0.295", 7.50mm Width)
  • 28-DIP (0.600", 15.24mm)
  • 20-TSSOP (0.173", 4.40mm Width)
  • 68-LCC (J-Lead)
  • 28-LCC (J-Lead)
  • 40-CDIP (0.600", 15.24mm)
  • 24-DIP (0.300", 7.62mm)
  • 474-BCBGA Exposed Pad
  • 53-TFBGA, FCCSP
  • 253-LFBGA, FCCSP
  • 48-TFBGA, FCCSPBGA
  • 144-LQFP
  • 56-VFBGA
  • 16-TSSOP (0.173", 4.40mm Width)
  • 14-DIP (0.300", 7.62mm)
  • 84-LCC (J-Lead)
  • 132-BQFP Bumpered
  • 32-DIP (0.600", 15.24mm) Socket
  • 28-DIP (0.600", 15.24mm) Socket
  • 44-QFP
  • Die

Product Status

  • Active
  • Obsolete
  • Not For New Designs

Series

  • EZ-USB NX2LP-Flex?
  • *
  • EZ-USB NX2LP?
  • IBM25PPC750FX

Supplier Device Package

  • 8-SOIC
  • 16-SOIC
  • 8-PDIP
  • 16-PDIP
  • 56-QFN (8x8)
  • 20-PDIP
  • 20-SOIC
  • 28-PDIP
  • 20-TSSOP
  • 68-PLCC (24.21x24.21)
  • 56-Sawn QFN-EP (8x8)
  • 28-PLCC (11.51x11.51)
  • 40-CDIP
  • 24-PDIP
  • 474-CBGA (25x32)
  • 53-FCCSP (7.5x3)
  • 253-FCCSP (8x13.5)
  • 48-FCCSP (3x8)
  • 144-TQFP (20x20)
  • 56-VFBGA (5x5)
  • 16-TSSOP
  • 14-PDIP
  • 56-QFN-EP (8x8)
  • 68-PLCC (25.13x25.13)
  • 84-PLCC (29.31x29.31)
  • 132-PQFP (24.13x24.13)
  • 32-DIP Socket
  • 28-DIP Socket
  • 44-QFP (10x10)
  • Die

Voltage - Supply

  • 3V ~ 3.6V
  • 4.75V ~ 5.5V
  • 4.5V ~ 5.5V
  • 3.135V ~ 3.465V
  • 1.2V
  • 2.5V
  • 2.25V ~ 3.6V
  • 2.7V ~ 3.6V
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